Metal Backed Materials, IMS, MCPCB

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Metal Backed Materials

This is an overview of some of the most available Metal Backed materials. Before you design a material in to your product, you must always  check with your manufacturer if the material chosen is available.

 

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As a world leader in thermal management solutions, Laird Technologies offers the Tlam™ thermally-conductive PCB substrate system.
Tlam™ thermally-conductive PCB substrates provide 8-10 times the heat dissipation compared to conventional FR4-based PCBs.
The miniaturation of electronic devices continues to pack more and more power into smaller and smaller packages.
The simplicity of the Tlam™ system takes the heat dissipation requirement in stride without significant design changes. The Tlam™ dielectrics are
the key to these high-performance PCB substrates.
The Tlam™ dielectric provides electrical isolation, thermal transfer, and adhesion layer for the substrates that are created for your specific needs.

 

Tlam™
ML 1KA
Tlam™
SS 1KA
Tlam™
SS HTD
Tlam™
SS LLD
DATA SHEET

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Kinwong LED material, KW-ALE 
Affordable materials for LED products. Available for high volumes. 

KW-ALE   DATA SHEET

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A highly thermally conductive insulated metal substrate (IMS) consisting of an aluminum base, an epoxy-based insulation layer with a high inorganic content filler demonstrating high thermal conductivity, and a conductive foil, thereby realizing thermal resistance equivalent to, or less than that of an alumina ceramic substrate.

Insulated Thermally Conductive Metal Circuit Board
DENKA HITT PLATE

(1) When good thermal conductivity is required
(2) When heat shock resistance is required
(3) When large substrates are required
(4) When wire bonding is required
(5) When surface mounting application using bare chips is required

Application Examples
Industrial electronics
Transistor (IGBT) modules - Rectifiers - Solid-state relays - Stepping motor drivers - AC servo motors - IPM - Power supplies

Household appliances
TV, VTR regulators - 
Audio power amplifiers - Output amplifiers - Equalizer amplifiers - Air conditioner inverters - Controllers for driving Plasma Display Panels 

Automotive
Igniters - 
Voltage regulators - ECU - Controllers - Motor drivers 

OA, Communications
Power supplies (DC-DC converters) - 
Printer drivers - Substrates for LED - Motor drivers


Others
Insulated thermally conductive board for semiconductors - 
IC packages 

 

HITT PLATE
 

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Thermal Clad substrates minimize thermal impedance and conduct heat more effectively and efficiently than standard printed wiring boards (PWB's).
These substrates are more mechanically robust than thick-film ceramics and direct bond copper constructions that are often used in these applications.

Thermal Clad is a cost-effective solution which can eliminate components, allow for simplified designs, smaller devices and an overall less complicated production processes. Additional benefits of Thermal Clad include lower operating temperatures, longer component life and increased durability.

Bergquist Thermal Clad substrates are not limited to use with metal base layers. In one example, power conversion applications can enhance their performance by replacing FR-4 with Thermal Clad dielectrics in multi-layer assemblies. In this application, the thickness of the copper circuit layer can be minimized by the high thermal performance of Thermal Clad.

 1 Thermal Clad Overview                          2011 Guide DATA SHEET
 2 Thermal Clad Applications  2011 Guide DATA CHEET
 3 Thermal Clad Reliability  2011 Guide DATA SHEET
 4 Selecting Dielectric Materials  2011 Guide DATA SHEET
 5 Dielectric Performance Considerations  2011 Guide DATA SHEET
 6 Summary of Key Dielectrics  2011 Guide DATA SHEET
 7 Advanced Circuit Processing  2011 Guide DATA SHEET
 8 Baseplate Design Considerations  2011 Guide DATA SHEET
 9 Selecting a Circuit Layer  2011 Guide DATA SHEET
10 Electrical Design Considerations  2011 Guide DATA SHEET
11 Assembly Recommendations  2011 Guide DATA SHEET 
12 Other Bergquist Products   2011 Guide DATA SHEET
13 Appendix  2011 Guide DATA SHEET
14 Thermal Clad Confiuration  2011 Guide DATA SHEET
     
 T-Clad 2011 FULL Guide (Chapter1-14)   DATA SHEET
 Thermal Management For LED Applications -solution guide DATA SHEET
 T-Clad Optimal Design ( White Paper )   Things to consider when designing  DATA SHEET

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LED PCB Materials Comparison Chart

Thickness Thermal Characteristics Dielectric Characteristics / Insulation Other
Bergquist HT-04503 3 0.05 2.2 1500 6.0 7 150 140/140 6
Bergquist HT-07006 6 0.07 2.2 2500 11.0 7 150 140/140 6
Bergquist LTI-04503 3 0.05 2.2 1500 6.5 7 90 130/130 6
Bergquist LTI-06005 6 0.09 2.2 2000 9.5 7 90 130/130 6
Bergquist MP-06503 3 0.09 1.3 1500 8.5 6 90 130/140 9
Bergquist CML-11006 6 0.21 1.1 2500 10.0 7 90 130/130 10
Laird T-lam SS 1KA04 4 0.05 3 1200   4.3/4.1 105 110 4.5
Laird T-lam SS 1KA06 6 0.08 3 2500   4.3/4.1 105 120 4.5
Laird T-lam SS 1KA08 8 0.11 3 3500   4.3/4.1 105 130 5
Laird T-lam SS HTD04 4 0.072 2.2 4000+ 2.5 5.1/4.9 168 150 6.5
Laird T-lam SS HTD06 6 0.107 2.2 6000+ 3.5 4.9/4.7 168 150 7
ISI Zeta Bond 1.0 mil 1           300+    
ISI Zeta Bond 1.5 mil 1.5     1000     300+    
DuPont CooLam LX03517016   0.05 0.8 2500   5.5 225 130 14
DuPont CooLam LX07022016   0.065 0.8 4000   5.5 225 130 14
UniPlus UP-HTC-P075016   0.09 1.3 1500 8.3 4.8 135 140/110 9.5
Iteq IT-858T (80 um)   0.128 2.2 6000+ 4.0+   159    
Iteq IT-858T (100 um)   0.128 2.2 6000+ 4.0+   159    
Iteq IT-859GT (80 um)   0.126 2.2 6000+ 4.0+   156    
Iteq IT-859GT (100 um)   0.126 2.2 6000+ 4.0+   156    
Taconic TacLED-4   0.19 0.4 3000+ 3.0+ 3.05 327   12
Taconic TacLED-10   0.13 1   6.0+ 4.6 136   9.5
Taconic TacLED-20   0.06 2   6.0+ 5.2 125   8.4
Ventec VT-4A2 3 0.054 2.2 4500 5.0+ 5.1 130 90/90 7.5
Ventec VT-4A2 4 0.072 2.2 5000 5.0+ 5.1 130 90/90 7.5
Ventec VT-4A2 5 0.089 2.2 6000+ 5.0+ 5.1 130 90/90 7.5
Ventec VT-4A2 6 0.107 2.2 6000+ 5.0+ 5.1 130 90/90 7.5
Ventec VT-4A1 3 0.074 1.6 4500 5.0+ 5 170 90/90 8
Ventec VT-4A1 4 0.099 1.6 5000 5.0+ 5 170 90/90 8
Ventec VT-4A1 5 0.123 1.6 6000+ 5.0+ 5 170 90/90 8
Ventec VT-4A1 6 0.148 1.6 6000+ 5.0+ 5 170 90/90 8
Denka Hittplate K-1   0.53 2   3.0+ 7.1 104 115 17.6
Denka Hittplate M-2   0.5 2   3.0+ 4.4 120 155 17.6
Denka Hittplate TH-1   0.45 4   4.0+ 7.7 165 105 17.6
Denka Hittplate B-1   0.36 8   4.0+ 7.5 165   17.6
Denka Hittplate EL-1   0.49 2.5   4.0+ 7.4 57   17.6
Anotherm Anotherm 1.4 0.02 173            
Isola 370HR-106 2.5 0.1969 0.4 2700 2.7 4.2 180 130 4
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