Comparison of Typical Solder Paste and Wave Solders

Comparison of Typical Solder Paste and Wave Solders

Common Name             Typical Composition                            Comment         

BiSn

Bi 58% / Sn 42%

Melting point 138°C; Not recommended–relatively weak joint strength when 
subject to   temperature cycling; compatible with 100% matte tin finishes; 
not compatible with existing SnPb finishes.

SnPb (Eutectic)

Sn 60% / Pb 40%

Melting point 183°C; common use for electronic applications; compatible 
with 100% matte tin finishes; shiny appearance.

SAC305

Sn 96.5% / Ag 3.0%    /Cu0.5%                             

Melting point 219°C; compatible with existing SnPb finishes and 100% 
matte tin finishes; dull appearance.

SnAg

Sn 96.5% / Ag 3.5%

Melting point 221°C; compatible with 100% matte tin finishes; not compatible
with existing SnPb finishes.

SnCu

Sn 99.3% / Cu 0.5 %

Melting point 227°C; compatible with existing SnPb finishes and 100% 
matte tin finishes; dull appearance.

SN100

Sn >98% / Cu <1.0% / Ni <1.0%

Melting point 232°C; compatible with existing SnPb finishes and 100% 
matte tin finishes; shiny appearance.

SnPb (High-

Temperature) 

Sn 5% / Pb 95%

Melting point ≈ 300°C, common use for flip-chip and similar applications; compatible with 100% matte tin finishes and existing SnPb finishes.

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